1. 2. 3. material content data sheet sales product name sak-xc2220u-8f40v aa issued 29. august 2013 ma# MA000944298 package pg-vqfn-48-54 weight* 126.23 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 4.061 3.22 3.22 32174 32174 leadframe inorganic material phosphorus 7723-14-0 0.018 0.01 140 non noble metal zinc 7440-66-6 0.071 0.06 559 non noble metal iron 7439-89-6 1.412 1.12 11183 non noble metal copper 7440-50-8 57.319 45.41 46.60 454083 465965 wire noble metal gold 7440-57-5 0.848 0.67 0.67 6719 6719 encapsulation organic material carbon black 1333-86-4 0.175 0.14 1390 plastics epoxy resin - 7.426 5.88 58832 inorganic material silicondioxide 60676-86-0 50.874 40.30 46.32 403021 463243 leadfinish non noble metal tin 7440-31-5 2.340 1.85 1.85 18541 18541 plating noble metal silver 7440-22-4 0.656 0.52 0.52 5196 5196 glue plastics epoxy resin - 0.237 0.19 1877 noble metal silver 7440-22-4 0.793 0.63 0.82 6285 8162 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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